Hydroxylamine Free Base (Electronic Grade) (“HAFB EG”) is the key chemical to remove photoresist and etch residues on integrated circuits. However, the traditional manufacturing process for HAFB EG is highly explosive. Multiple market entrants left the market due to explosions and ensuing compliance and risk considerations. With the growing market of semiconductor production around the world, especially in the U.S., safe, low-cost, and ample supply of HAFB EG is a priority for the semiconductor and its affiliated chemical industries.
Vulpes has developed and validated a novel, proprietary manufacturing process for HAFB EG that does not have explosive risk and at a much lower cost relative to the prevailing manufacturing process.